EPoSS' this year's General Assembly and Annual Forum (http://www.smart-systems-integration.org/public/news-events/events/annual-forum) was hold on 8th and 9th October 2009 at the Palazzo Vermexio in Syracuse, Sicily. The SMARTIEHS system was presented in a presentation of

K. Schjølberg-Henriksen and D.T. Wang "APPLICATION-SPECIFIC SMART SYSTEM INTEGRATION"

Abstract:

The vision ”more than Moore” for smart systems can be achieved by several approaches. The

optimal approach depends on the device and its application. Here, two essential components

for smart system integration are presented: Multichip integration exemplified by a tyre

pressure monitoring system (TPMS) and direct integration of piezoelectric actuators on micro

optical components.

For the TPMS, the silicon pressure sensor needed the added functionality of a transceiver, a

microcontroller and a bulk acoustic resonator. Incorporating all necessary functionality in one

silicon chip was unfeasible. Instead, four individual chips were joined electrically and

mechanically using through-silicon vias (TSVs) and chip bonding. Different TSV and

bonding technologies were evaluated based on the requirements for the TPMS. The results of

the technology evaluation and the final solution will be presented in the talk.

Micro optical components typically need a displacement of 10-20 μm. This can be achieved

by integrating piezoelectric bending mode actuators directly on the optical components. Two

components based on this will be presented: A variable focus lens and a micro spectrometer.